Specialized rotary joint for semiconductor wafer thinning equipment
11Specialized rotary joint for semiconductor wafer thinning equipment
View detailsSemiconductor cutting machine high-speed rotary joint
characteristic
1) The speed reaches up to 3000rpm,
2) Low torque;
3) Long lifespan, adopting a special structural design, equipped with automatic air cooling heat dissipation, and almost frictionless rotation;
4) Compact structure, suitable for installation in narrow spaces;
5) Small axial runout, especially suitable for cutting machines.
technical indicators
| Medium | vacuum | compressed air |
| Pressure (Kpa) | -95 | 600 |
| Speed (rpm) | 3000 | |
| Fluid diameter (mm) | 5 | |
| Number of channels | 1-3 | |
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