A07 type semiconductor rotary joint

1. Product Overview
The ML02R005F-A07 rotary joint is a high-precision dynamic sealing component specially developed for semiconductor manufacturing equipment. This model aims to solve the problem of stable transmission of cooling medium or gas during high-speed and high-precision processing of semiconductor equipment, and has significant import substitution capability. Its design focuses on meeting the stringent requirements of cleanliness, low vibration, and long lifespan in semiconductor workshops.

2. Core technical parameters and specifications
Based on industry common naming conventions and product features of the same series (such as ML08/ML06/ML04), the key technical indicators of ML02R005F-A07 are derived as follows:
Number of channels: 2 channels (model prefix “ML02” usually refers to dual channel design), suitable for scenarios that require independent fluid circulation in and out.
Diameter size: 5mm (the middle section of the model usually corresponds to a nominal diameter of 5mm), ensuring sufficient flow through in a compact space.
Connection form: flange or threaded fixation (suffix “A07” represents specific installation interface standards), easy to integrate into various semiconductor spindles or robotic arms.
Applicable media: deionized water, coolant, compressed air, or specific process gases.
3. Main performance characteristics
3.1 High reliability and long lifespan
Adopting advanced mechanical seal structure design, combined with special wear-resistant materials, significantly reduces the friction coefficient. The internal structure has been optimized to achieve almost frictionless rotation, effectively extending the service life and reducing downtime caused by maintenance on the semiconductor production line.
3.2 Zero Leakage and Clean Environmental Protection
In response to the extremely high environmental cleanliness requirements of semiconductor workshops, this joint adopts multiple sealing technologies to achieve “zero leakage” operation. Eliminate coolant or process gas leakage, avoid contaminating the wafer or workshop environment, and comply with green manufacturing standards.
3.3 Low torque and smooth start
Featuring low starting torque characteristics, it ensures even force distribution during the start stop moment of the equipment, avoiding spindle shaking or positioning deviation caused by sudden torque changes. It is particularly suitable for stability sensitive equipment such as cutting machines and lithography machines.
3.4 Compact Structure and Integration Advantages
Small in size and with minimal axial runout, it is very suitable for installation in narrow spaces. Its compact design helps to reduce the overall device height and improve the space utilization of semiconductor equipment. Some models support tail connected slip rings, and the center hole can be used to thread cables, achieving integrated transmission of gas/liquid/electricity.
3.5 Heat dissipation and corrosion resistance
Some configurations can be equipped with an automatic air-cooled cooling structure to adapt to the heat generated during high-speed operation. If corrosive process fluids are involved, strong acid and alkali resistant materials (such as special sealing materials and O-rings) can be selected, and they should have a certain ability to resist particle pollutants.
4. Typical application scenarios
The ML02R005F-A07 rotary joint is widely used in the following semiconductor manufacturing processes:
Wafer cutting (slicing): Provides continuous cooling water flow to the blade to prevent high temperature damage to the edge of the wafer.
Grinding and Polishing (CMP): Transport grinding solution and maintain stable pressure to ensure surface flatness.
Etching and cleaning: Transporting chemical reagents or deionized water requires extremely high sealing and corrosion resistance.
Packaging testing equipment: used for temperature control medium transmission in processes such as hot press bonding.
5. Selection and maintenance suggestions
Installation precautions: During installation, ensure concentricity to avoid premature wear of the sealing surface caused by eccentric loads. It is strictly prohibited to hammer or forcefully assemble.
Media filtration: It is recommended to install a filter at the inlet end to prevent impurities from entering the sealed chamber and affecting the sealing performance.
Regular inspection: Although designed to be maintenance free, it is still recommended to regularly monitor leakage and rotational resistance, and replace seals in a timely manner if any abnormalities are found.