Rotating joint for MSC3005R05 thinning equipment

MSC3005R05 is a hollow spindle free rotary joint, and the center hole needs to be installed on the client’s spindle, which requires a fluid hole to be opened. This type of rotary joint can be integrated with the client’s spindle, making the client’s equipment more integrated. The number of major channels is 5. This type of rotary joint adopts a mechanical seal design. The diameter of the central hole is 29.

MSC3005R05 Semiconductor Thinning Equipment Special Rotating Joint Product Introduction
Product Overview
MSC3005R05 is a multi-path rotary joint designed specifically for semiconductor wafer thinning machines and polishing equipment, also known as a water/gas slip ring joint. This component is a key dynamic sealing component in semiconductor manufacturing equipment, mainly used to stably transport fluid media such as grinding fluid, cooling water, compressed air, and discharge grinding residue during high-speed rotation of the equipment spindle. Its core function is to achieve seamless fluid connection between the static pipeline system and the rotating spindle, ensuring the continuity and accuracy of the wafer processing process.
Core technical features
1. Hollow spindle free integrated design
The MSC3005R05 adopts a unique hollow spindle free structure with a central hole diameter of 29mm. This design allows the rotary joint to be directly fitted and integrated onto the spindle of the customer’s equipment, requiring the customer’s spindle to have corresponding fluid holes. This integrated solution significantly reduces the overall height of the equipment, optimizes the spatial layout, and enhances the compactness of the equipment.
2. Multi channel fluid management
This model has 5 large channel quantities, which can simultaneously meet the independent conveying needs of multiple media. In complex thinning processes, it can be used to supply fresh grinding fluid, cooling fluid, compressed air blowing, and recover waste liquid, effectively avoiding cross contamination between media and ensuring process stability.
3. Excellent dust resistance and wear resistance
MSC3005R05 adopts a reinforced mechanical seal design to address the large amount of fine particles and dust generated during the semiconductor thinning process. Its structure does not have extremely high requirements for fluid cleanliness and has strong resistance to dust intrusion, which can effectively prevent particles from entering the sealing surface and causing wear or leakage, extending the maintenance cycle.
4. Low starting torque and low heat generation
Low starting torque: The optimized internal friction pair design makes the equipment start more smoothly, reduces the impact on the drive motor, and helps improve the initial accuracy of wafer processing.
Low heat generation: Under long-term closed space installation and continuous operation conditions, this connector has extremely low heat generation, avoiding seal failure or equipment deformation caused by thermal expansion, ensuring reliability for long-term operation.
5. Modularity and cost advantages
Adopting a modular design concept not only facilitates later maintenance and component replacement, but also effectively reduces customers’ procurement costs and inventory pressure. The standardized interface design makes it easy to adapt to thinning devices of different brands