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Semiconductor cutting machine high-speed rotary joints

Semiconductor cutting machine high-speed rotary joint

  • medium
  • Operating Temperature
  • work pressure
  • maximum speed

characteristic
1) The speed reaches up to 3000rpm,
2) Low torque;
3) Long lifespan, adopting a special structural design, equipped with automatic air cooling heat dissipation, and almost frictionless rotation;
4) Compact structure, suitable for installation in narrow spaces;
5) Small axial runout, especially suitable for cutting machines.


technical indicators

 

mediumvacuumCompressed air, which may contain a small amount of water and dust
Pressure (Kpa)-95600
Rotational speed (rpm)3000
number of channels1-3
Fluid diameter (mm)5

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