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Semiconductor CMP wafer polishing dedicated rotary joints

Semiconductor CMP wafer polishing dedicated rotary head

  • medium
  • Operating Temperature
  • work pressure
  • maximum speed

1. Characteristics
1) Low leakage rate ensures that the equipment can adsorb workpieces for a long time;
2) Small size is beneficial for reducing the height of customer equipment;
3) Low starting torque, equipment starts smoothly;
4) Low heat generation, can be installed in enclosed spaces for a long time;
5) Modular design reduces customer procurement costs;
Long lifespan, using mechanical seals.

rotary joints

2. Technical indicators

 

mediumvacuumnitrogenCDA
Pressure (Kpa)-95150150
Rated speed (rpm)250250250
leakage rateAll channels are available 150KPa@250rpm Leakage rate ≤ 0.35KPa/min
number of channels1-12
Fluid diameter (mm)3.2

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