ML02R008F Semiconductor Rotary Joints

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ML02R008F is a high-performance two-way rotary joint designed specifically for the semiconductor manufacturing industry, widely used in key equipment such as chemical mechanical polishing machines (CMP) and wafer thinning machines. This model serves as the core component of the water/air slip ring joint, mainly responsible for the stable transportation of fluid media such as grinding fluid, pure water, coolant, and compressed air. It aims to solve the sealing problem under high-speed rotating conditions, ensure high reliability of the host operation, and significantly reduce maintenance frequency.

Features:
1-8 channels are optional
Low rotational torque
Minor leakage
Multi channel customized design
Can have through-hole design
Technological advantages and application value
Special sealing scheme
Adopting a special material mechanical seal structure optimized for the semiconductor environment, it has excellent sealing performance. This design can effectively resist the invasion of grinding residue dust, prevent leakage caused by particle wear, and thus extend the service life.
Low heat generation and low torque characteristics
At a rated speed of 250 rpm, ML02R008F can control the operating torque within 2 N · m while maintaining a temperature rise of no more than 30 ℃. This characteristic is crucial for precision semiconductor processing equipment, as it can avoid thermal deformation or changes in dielectric properties caused by local overheating, ensuring the consistency of wafer processing.
Modularity and high reliability
This rotary joint follows the modular design concept, which not only facilitates installation and maintenance, but also reduces customers’ procurement and replacement costs through standardized interfaces. Its long lifespan directly reduces unplanned downtime and improves overall production efficiency.
ML02R008F mainly serves the following semiconductor manufacturing processes:
CMP process: Transport polishing solution and deionized water to achieve planarization of the wafer surface.
Wafer cleaning and cooling: Provide stable coolant circulation and control processing temperature.
Other precision fluid transmission: suitable for connecting rotating components that require high-precision, leak free fluid control.